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Google Pixel 10 Series' Tensor G5 Chip to Arrive With Several Changes, Including Custom Camera ISP: Report

Google Pixel 10 Series' Tensor G5 Chip to Arrive With Several Changes, Including Custom Camera ISP: Report

  • 19.03.2025 08:09
  • gadgets360.com
  • Keywords: AI, Startup

Google's Tensor G5 chip will be produced using TSMC's 3nm process, featuring a custom camera ISP and other Google-designed components. The new chip replaces Samsung-made parts with third-party solutions, aiming to improve efficiency and performance.

Alphabet ReportsSNPSsentiment_satisfied

Estimated market influence

Google

Negativesentiment_dissatisfied
Analyst rating: N/A

Negative impact on Google's market position due to reliance on external chip manufacturers.

Samsung

Negativesentiment_dissatisfied
Analyst rating: N/A

Loss of revenue from Tensor chip production as Google switches to TSMC.

TSMC

Positivesentiment_satisfied
Analyst rating: N/A

Gain in revenue and market share due to winning Google's Tensor G5 chip contract.

Imagination Technologies

Positivesentiment_satisfied
Analyst rating: N/A

Increased GPU usage in Google's chips, boosting their graphics performance.

Chips&Media

Positivesentiment_satisfied
Analyst rating: N/A

Gain in market share due to supplying video IP to Google's Tensor G5 chip.

VeriSilicon

Positivesentiment_satisfied
Analyst rating: N/A

Increased usage of their display controller, enhancing image quality.

Synopsys

Synopsys

Positivesentiment_satisfied
Analyst rating: Strong buy

Gain in revenue from providing interface controllers to Google's Tensor G5 chip.

SmartDV

Positivesentiment_satisfied
Analyst rating: N/A

Increased usage of their solutions, boosting their market presence.

Faraday Technologies

Positivesentiment_satisfied
Analyst rating: N/A

Gain in revenue from supplying components to Google's Tensor G5 chip.

Context

Analysis of Google Pixel 10 Series' Tensor G5 Chip Launch

Key Facts and Data Points

  • Tensor G5 Production: Manufactured using TSMC's 3nm process technology.
  • Shift in Supplier: Transitioning from Samsung to TSMC for chip production.
  • Custom Components:
    • Google's always-on compute (AoC) audio processor.
    • Google Emerald Hill memory coprocessor.
    • Google GXP DSP.
    • Google EdgeTPU.
  • GPU Update: Replacing Samsung with Imagination Technologies DXT GPU.
  • Video Codec Change: Dropping BigWave (AV1) and Samsung MFC in favor of Chips&Media's WAVE677DV.
  • Display Controller: Switching from Samsung to VeriSilicon DC9000.
  • Interface Controllers: Replacing Samsung with third-party providers like Synopsys, SmartDV, and Faraday technologies.

Market Implications

  • Performance and Efficiency: The Tensor G5 is expected to deliver improved performance and efficiency compared to the Tensor G4, leveraging TSMC's advanced 3nm process.
  • Vertical Integration: Google's move towards custom components positions it as more vertically integrated, potentially offering better control over hardware and software optimization.
  • Competitive Dynamics: The shift away from Samsung could reduce dependency on a single supplier, mitigating risks of supply chain disruptions. However, it also increases competition with other chip manufacturers like Apple (with its M-series chips) and Qualcomm.

Strategic Considerations

  • Supply Chain Diversification: By switching to TSMC and third-party providers, Google is diversifying its supply chain, which could enhance reliability but may also complicate integration and support.
  • Custom ISP: The inclusion of a custom camera ISP could further differentiate Google's Pixel series in the market, particularly in photography capabilities.

Long-Term Effects

  • AI and Machine Learning: The inclusion of Google EdgeTPU suggests a focus on AI acceleration, which could enhance features like real-time translation, object recognition, and more.
  • Market Positioning: This move reinforces Google's commitment to innovation in hardware, potentially strengthening its position against competitors like Apple and Samsung.

Regulatory Impact

  • No direct regulatory implications are mentioned, but changes in hardware components may require updates to compliance standards for compatibility and performance.